Integrated circuit comprising solder bumps

Details Integrated circuit comprising solder bumps Integrated circuit comprising solder bumps

1997-08-29

1998-07-28

Pianalto, Bernard

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Noninterengaged fiber-containing paper-free web or sheet...

427 96, 427534, 427569, 428457, 428696, 428704, B05D 512

Patent

active

057860734

ABSTRACT:
A method for cleaning solder bumps on a substrate that may be employed in a flip-chip design, for example, is described. The method of cleaning includes placing the substrate having the solder bumps into a plasma reactor, introducing a source gas including nitrogen trifluoride gas into the plasma reactor, striking a plasma from the source gas in the plasma reactor, and forming a fluoride compound on the surface of the solder bump.

REFERENCES:
patent: 4921157 (1990-05-01), Dishon et al.
patent: 5407121 (1995-04-01), Koopman et al.
patent: 5499754 (1996-03-01), Bobbio et al.

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