Integrated circuit comprising MOS transistors having electrodes

Fishing – trapping – and vermin destroying

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430396, 430311, 1566591, 148DIG19, 148DIG147, 148DIG152, 437200, G03C 500, G03C 504, H01L 2100, B44C 122

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047313188

ABSTRACT:
A novel MOS transistor structure comprises electrodes of metallic silicide and especially tantalum silicide. In the case of the gate electrode, the silicide is directly in contact with an insulating thin-film layer. In the case of the drain and source electrodes, the silicide is directly in contact with the monocrystalline silicon. The method of fabrication is thus simplified while avoiding the use of polycrystalline silicon.

REFERENCES:
patent: 4384301 (1983-05-01), Tasch et al.
patent: 4505027 (1985-03-01), Schwabe et al.
patent: 4593454 (1986-06-01), Baudrant et al.
Refractory Silicides for Integrated Circuits, S. P. Murarka, J. Voc. Sci. Technol., 17(4), Jul./Aug. 1980, pp. 775-792.
IEEE Transactions on Electron Devices, vol. ED-31, No. 9, Sep. 1984, pp. 1329-1334, IEEE, New York, US; Hidekazu Okabayashi et al., "Low Resistance MOS Technology Using Self-Aligned Refractory Silicidation".
IBM Technical Disclosure Bulletin, vol. 25, No. 3B, Aug. 1982, pp. 1396, 1397, New York, US; H. J. Geipel et al.: "Process for Simultaneously Making Silicide Gate, Source and Drain Electrodes".

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