Integrated circuit comprising an auxiliary component, for...

Details Integrated circuit comprising an auxiliary component, for... Integrated circuit comprising an auxiliary component, for...

2005-01-25

2005-01-25

Ghyka, Alexander (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S051000, C438S455000

Reexamination Certificate

active

06846690

ABSTRACT:
The fabrication of an integrated circuit includes a first phase of producing an electronic chip and a second phase of producing at least one auxiliary component placed above the chip and of producing a protective cover which covers the auxiliary component. The first phase of producing the chip is effected from a first semiconductor substrate and comprises the formation of a cavity lying in a chosen region of the chip and emerging at the upper surface of the chip. The second production phase includes the production of the auxiliary component from a second semiconductor substrate, separate from the first, and then the placement in the cavity of the auxiliary component supported by the second substrate and the mutual adhesion of the second substrate to the upper surface of the chip lying outside the cavity. The second substrate then also forms the protective cover.

REFERENCES:
patent: 4773972 (1988-09-01), Mikkor
patent: 100 27 234 (2000-12-01), None
patent: 0772045 (1995-07-01), None
patent: 0 772 045 (1997-05-01), None
patent: 1 079 431 (2001-02-01), None
patent: 1 096 259 (2001-05-01), None
patent: WO 0129529 (2001-04-01), None
French Preliminary Search Report dated Jul. 16, 2002 for French Application No. 0115594.

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