Integrated circuit component with a surface-mount housing

Details Integrated circuit component with a surface-mount housing Integrated circuit component with a surface-mount housing

2007-08-16

2010-02-16

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S693000, C257S698000, C257S731000, C257S779000, C257SE21499, C257SE23061, C257SE23119, C257SE33058

Reexamination Certificate

active

07663218

ABSTRACT:
A semiconductor component including a surface-mount housing and a method for producing the same are described herein. The semiconductor component includes lead pieces embedded into a plastic housing composition and arranged on an underside of the housing. External contact areas of the lead pieces are free of the plastic housing composition. A structured solderable coating is arranged on the external contact areas that have been kept free of the plastic housing composition, the coating includes a plurality of electrically conductive and mechanically elastic contact elements.

REFERENCES:
patent: 4209481 (1980-06-01), Kashiro et al.
patent: 4996476 (1991-02-01), Balyasny et al.
patent: 5006962 (1991-04-01), Haley
patent: 5548087 (1996-08-01), Dahringer
patent: 5805424 (1998-09-01), Purinton
patent: 6188582 (2001-02-01), Peter
patent: 6259036 (2001-07-01), Farnworth
patent: 2004/0036181 (2004-02-01), Hedler et al.
patent: 2006/0280320 (2006-12-01), Song et al.
patent: 3635708 (1988-04-01), None
patent: 0265077 (1988-04-01), None
patent: 1213756 (2002-06-01), None

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