Integrated circuit component package with integral passive compo

Details Integrated circuit component package with integral passive compo Integrated circuit component package with integral passive compo

1994-12-30

1997-05-27

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257528, 257531, 257532, 257536, 361765, 361782, H05K 116, H01L 298605, H01L 2992

Patent

active

056337850

ABSTRACT:
A high-performance, high-density integrated circuit component package includes an IC chip having a plurality of IC bond pads and an interconnect substrate overlying the IC chip. The interconnect substrate includes a plurality of I/O surface pads arrayed across a surface of the interconnect substrate. The I/O surface pads are electrically connected to the IC bond pads via a plurality of traces internal to the interconnect substrate. The interconnect substrate further includes at least one layer comprising capacitive, resistive or inductive material integrally formed therein.

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