Integrated circuit chips made bendable by forming indentations i

Details Integrated circuit chips made bendable by forming indentations i Integrated circuit chips made bendable by forming indentations i

1996-07-02

1998-07-28

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361749, 361736, 361783, 361807, 361737, 361684, 257618, 257622, 257730, 257679, 257620, 235492, 235487, H05K 118

Patent

active

057869880

ABSTRACT:
The flexibility of normally brittle and breakable integrated circuit chips is increased by forming grooves, trenches, a series of holes, or the like, in a surface of the circuit chips that is opposite to the surface on which the integrated circuit is formed. Packages including one or more such circuit chips can then be bent to some degree without breaking the chips. This is quite useful for emerging flexible circuit chip packages, and for credit card sized packages that include one or more circuit chips, such as the smart card carried by individuals.

REFERENCES:
patent: 3702464 (1972-11-01), Castrucci
patent: 4266334 (1981-05-01), Edwards et al.
patent: 4417413 (1983-11-01), Hoppe et al.
patent: 4803542 (1989-02-01), Haghiri-Tehrani et al.
patent: 4804828 (1989-02-01), Oogita
patent: 4889980 (1989-12-01), Hara et al.
patent: 4943708 (1990-07-01), Simmons et al.
patent: 5031026 (1991-07-01), Ueda
patent: 5130783 (1992-07-01), McLellan
patent: 5255430 (1993-10-01), Tallaksen
patent: 5261999 (1993-11-01), Pinker et al.
patent: 5264990 (1993-11-01), Vernambre
patent: 5311396 (1994-05-01), Steffen
patent: 5399907 (1995-03-01), Nguyen et al.
patent: 5480842 (1996-01-01), Clifton et al.
patent: 5581445 (1996-12-01), Horejs, Jr. et al.

Affiliated with

Also associated with

Rating

Integrated circuit chips made bendable by forming indentations i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit chips made bendable by forming indentations i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit chips made bendable by forming indentations i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-27656