Integrated circuit chips cooling module having coolant leakage p

Details Integrated circuit chips cooling module having coolant leakage p Integrated circuit chips cooling module having coolant leakage p

1987-05-21

1989-09-26

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361385, H01L 2346, H01L 2336

Patent

active

048704776

ABSTRACT:
An improved integrated circuit chips cooling module in which a cooling member having an inside space through which a coolant flows is attached to each of the integrated circuit chips by pressure welding or anchoring to effect cooling, wherein the improvement comprises providing coated portions for each portion of the surface of the coolant flow system where the coolant leakage may possibly take place, the coating of said coated portions comprising an organic or inorganic high-molecular weight compound curable by reacting with the coolant to keep the latter from leakage.

REFERENCES:
patent: 4558395 (1985-12-01), Yamada et al.
patent: 4644385 (1987-02-01), Nakanishi et al.
patent: 4686606 (1987-08-01), Yamada et al.

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