Integrated circuit chip with modular design

Details Integrated circuit chip with modular design Integrated circuit chip with modular design

2008-05-30

2011-10-04

Dinh, Paul (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Integrated circuit design processing

Physical design processing

C716S118000, C716S119000, C716S120000, C716S121000, C716S126000, C716S129000, C716S130000

Reexamination Certificate

active

08032849

ABSTRACT:
Disclosed is a procedure or design approach for functional modules that may be used in connection with a multiprocessor integrated circuit chip. The approach includes keeping the dimensions of each module substantially the same and having the bus, power, clock and I/O connection configured the same on all modules. Further requirements for ease of use are to generalize the capability of each module as much as possible and to decentralize functions such as testing to be primarily performed within each module. The use of such considerations or rules substantially eases the design of a given type of custom chips, and based upon an initial chip design greatly facilitates the design of further custom chips, similar in application, but subsequent to the successful completion of the initial chip. The standardization modules and replication of the modules on a given chip also reduces physical verification time in initial chip design as well as redesign time of the initial chip when requirements for chip capability are redefined or otherwise changed. Any subsequent or further custom chips can include more or less of specific modules based upon already established parameters.

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