Semiconductor device manufacturing: process – Having biomaterial component or integrated with living organism
Reexamination Certificate
2006-10-31
2006-10-31
Huynh, Andy (Department: 2818)
Semiconductor device manufacturing: process
Having biomaterial component or integrated with living organism
C257S040000, C257SE51040, C257SE27004, C257SE51038, C977S742000, C977S778000, C977S762000
Reexamination Certificate
active
07129097
ABSTRACT:
A conductive layer in an integrated circuit is formed as a sandwich having multiple sublayers, including at least one sublayer of oriented carbon nanotubes. The conductive layer sandwich preferably contains two sublayers of carbon nanotubes, in which the carbon nanotube orientation in one sublayer is substantially perpendicular to that of the other layer. The conductive layer sandwich preferably contains one or more additional sublayers of a conductive material, such as a metal. In one embodiment, oriented carbon nanotubes are created by forming a series of parallel surface ridges, covering the top and one side of the ridges with a catalyst inhibitor, and growing carbon nanotubes horizontally from the uncovered vertical sides of the ridges. In another embodiment, oriented carbon nanotubes are grown on the surface of a conductive material in the presence of a directional flow of reactant gases and a catalyst.
REFERENCES:
patent: 2002/0025374 (2002-02-01), Lee et al.
patent: 2002/0153160 (2002-10-01), Hofmann et al.
patent: 2003/0165418 (2003-09-01), Ajayan et al.
patent: 2003/0178617 (2003-09-01), Appenzeller et al.
patent: 2004/0005258 (2004-01-01), Fonash et al.
patent: 2004/0152240 (2004-08-01), Dangelo
patent: 2 382 718 (2002-06-01), None
S. Huang, et al., “Oriented Long Single Walled Carbon Nanotubes on Substrates from Floating Catalysts”, Letters, Journal of Physical Chemistry, vol. 107, No. 48 (Dec. 4, 2003).
S. Huang, et al., “Growth of Millimeter-Long and Horizontally Aligned Single-Walled Carbon Nanotubes on Flat Substrates”, Journal of the American Chemical Society, vol. 125, No. 19, Apr. 22, 2003).
J. Li, et al., “Bottom-up approach for carbon nanotube interconnects”, Applied Physics Letters (vol. 82, No. 15, Apr. 14, 2003) Abstract Only.
W. Li, et al., “Clean double-walled carbon nanotubes synthesized by CVD”, Chemical Physics Letters 368, 299-06 (2003).
L. Kalaugher, “Infineon forges ahead with nanotube applications” (Published on World Wide Web at nanotechweb.org Dec. 2002).
B. Zheng, et al., “Efficient CVD Growth of Single-Walled Carbon Nanotubes on Surfaces Using Carbon Monoxide Precursor”, Nano Letters, American Chemical Society (Manuscript dated Jun. 26, 2002).
Z. Huang, et al. “Effect of nickel, iron and cobalt on growth of aligned carbon nanotubes”, Applied Physics A 74, 387-391 (Mar. 4, 2002).
W Li, et al., “Effect of temperature on growth and structure of carbon nanotubes by chemical vapor deposition”, Applied Physics A 74, 397-402 (Mar. 4, 2002).
W. Li, et al., “Effect of gas pressure on the growth and structure of carbon nanotubes by chemical vapor deposition”, Applied Physics A 73, 259-264 (Jun. 20, 2001).
Y. Li, et al., “Preparation of Monodispersed Fe-Mo Nanoparticles as the Catalyst for CVD Synthesis of Carbon Nanotubes”, Chem. Mater. vol. 13, No. 3, (American Chemical Society Feb. 6, 2001).
D. Li, et al., “Structure and growth of aligned carbon nanotube films by pyrolysis”, Chemical Physics Letters 316, 349-355 (Jan. 21, 2000).
Z.F. Ren, et al., “Large Arrays of Well-Aligned Carbon Nanotubes”, Proceedings of 13thInt'l Winter School on Electronic Properties of Novel Materials, pp. 263-267 (Feb. 27- Mar. 6, 1999).
Furukawa Toshiharu
Hakey Mark Charles
Holmes Steven John
Horak David Vaclav
Koburger III Charles William
Huynh Andy
Truelson Roy W.
LandOfFree
Integrated circuit chip utilizing oriented carbon nanotube... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit chip utilizing oriented carbon nanotube..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit chip utilizing oriented carbon nanotube... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3686850