Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-05-13
2000-12-19
Gandhi, Jayprakash N.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257738, 257778, 438108, 438613, 438615, 22818022, 29832, 29840, H01L 2348
Patent
active
061634638
ABSTRACT:
An interconnection between bonding pads on an integrated circuit chip and corresponding bonding contacts on a substrate are formed. To form the interconnection, a metallization is formed on each of the substrate bonding contacts. Metal ball bond bumps are formed on selective ones of the bonding pads and then coined. The substrate and integrated circuit chip are heated. The coined ball bond bumps are then placed into contact with the corresponding metallizations, pressure and ultrasonic energy are applied, and a metal-to-metal bond is formed between each coined ball bond bump and the corresponding metallization.
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Amkor Technology Inc.
Gandhi Jayprakash N.
Lawrence Don C.
Vigushin John B.
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