Integrated circuit chip structure wiring and circuitry for drivi

Electrical transmission or interconnection systems – Nonlinear reactor systems – Parametrons

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 51, 357 68, 357 71, 307267, 307270, 307456, 307457, 307465, 307466, H01L 2710, H01L 2715, H01L 2702

Patent

active

047745592

ABSTRACT:
The disclosure is directed to integrated circuit chips and particularly to "gate array", or "master slices" whereon one or more circuits drive a highly capacitive on chip wiring net. The driving circuits are modified and a compensation circuit coupled to the highly capacitive on chip wiring net to mitigate the burden caused by the high capacitance. The integrated circuit structure also contains efficiently positioned on each chip a number of compensation circuits which are readily connectable during the fabrication of the chip. The employment of one, or a number of, on chip compensation circuits does not materially increase the chip power consumption.

REFERENCES:
patent: 3488564 (1970-01-01), Crafts
patent: 3513365 (1970-05-01), Levi
patent: 3534236 (1970-10-01), Bean et al.
patent: 3555294 (1973-10-01), Treadway
patent: 3562547 (1971-02-01), Brode
patent: 3610951 (1971-10-01), Howland
patent: 3631309 (1971-12-01), Myers
patent: 3656004 (1972-04-01), Kemerer
patent: 3909636 (1975-09-01), Masaki et al.
patent: 4000429 (1976-12-01), Yoshida et al.
patent: 4200811 (1980-04-01), Balaban et al.
patent: 4249193 (1981-02-01), Balyoz et al.
patent: 4278897 (1981-07-01), Ohno et al.
patent: 4295149 (1981-10-01), Balyoz et al.
patent: 4417159 (1983-11-01), Dorler et al.
patent: 4489417 (1984-12-01), Askin et al.
patent: 4499484 (1985-02-01), Tanizawa et al.
patent: 4584653 (1986-04-01), Chih et al.
"Use of Emitter in an Unused Transistor as an Underpass", by D. S. Hershman, IBM Technical Disclosure Bulletin, vol. 14, No. 4, Sep. 1971, p. 1207.
"Integrated Delay Circuit", by H. Heimeier, E. Klink & F. Wernicke, IBM Technical Disclosure Bulletin, vol. 21, No. 2, Jul. 1978, pp. 656-657.
"I.C.S. for Temperature Sensing and Control", by J. A. Morrison, Integrated Circuits, vol. II, No. 20, Oct. 1978.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Integrated circuit chip structure wiring and circuitry for drivi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit chip structure wiring and circuitry for drivi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit chip structure wiring and circuitry for drivi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2400232

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.