Integrated circuit chip stacking

Details Integrated circuit chip stacking Integrated circuit chip stacking

1988-11-04

1990-09-11

Davie, James W.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

361396, H01L 2302

Patent

active

049566946

ABSTRACT:
A device for increasing the density of integrated circuit chips on a printed circuit board. A plurality of integrated circuits are packaged within chip carriers and stacked, on one top of the other, on a printed circuit board. Each of the input/output data terminals, power and ground terminals of the chips are connected in parallel. Each chip is individually accessed by selectively enabling the desired chip.

REFERENCES:
patent: 4371912 (1983-02-01), Gazik
patent: 4638348 (1987-01-01), Brown et al.
patent: 4761681 (1988-08-01), Reid
patent: 4841355 (1989-06-01), Parks
patent: 4868712 (1989-09-01), Woodman
"Megabyte Per Cubic Inch", Defense Science, p. 56, May 1988.
"Three-Dimensional Packaging", Defense Science, p. 65, May 1988.

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