Integrated circuit chip package having signal input/output conne

Details Integrated circuit chip package having signal input/output conne Integrated circuit chip package having signal input/output conne

1992-04-21

1992-12-01

Wojciechowicz, Edward J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

361381, 361385, 361386, 257700, 257713, 257714, H01L 3902

Patent

active

051683474

ABSTRACT:
An integrated circuit chip package having a substrate containing integrated circuit chips thereon; signal input/out connections for the chips located at edges of a substrate; and conductive power planes are separated from the signal input/output connections and are removably connected to the substrate.

REFERENCES:
patent: 4970577 (1990-11-01), Ogihara et al.
patent: 5016138 (1991-05-01), Woodman

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