Integrated circuit chip package having configurable contacts and

Details Integrated circuit chip package having configurable contacts and Integrated circuit chip package having configurable contacts and

1997-10-10

1999-04-20

Niebling, John F.

Semiconductor device manufacturing: process

Repair or restoration

438110, 438127, 438612, H01L 2100, H01L 2144, H01L 2148, H01L 2150

Patent

active

058952306

ABSTRACT:
An integrated circuit chip package having an electrical contact configurable for either signal or power/ground and a method for constructing the integrated circuit chip package are disclosed. The integrated circuit chip package includes a substrate for supporting an integrated circuit chip and a dedicated conductor for supplying voltage to the integrated circuit chip. A configurable contact is attached to a surface of the substrate. The integrated circuit chip package further includes a signal connection for electrically connecting a signal connector of an integrated circuit chip and the configurable contact. A removable connector electrically connects the configurable contact and the dedicated conductor, thereby enabling the configurable contact to be configured as either a signal or power/ground contact depending upon the absence or presence of the electrical connection between the configurable contact and the dedicated conductor provided by the removable connector.

REFERENCES:
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5334857 (1994-08-01), Mennitt et al.
patent: 5489551 (1996-02-01), Castleberry

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