Integrated circuit chip package having configurable contacts and

Details Integrated circuit chip package having configurable contacts and Integrated circuit chip package having configurable contacts and

1996-01-31

1998-06-09

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257691, 257693, 257700, 257758, 361794, 361774, 439 65, H01L 23053, H01L 2352, H01L 2348, H01L 2940

Patent

active

057639477

ABSTRACT:
An integrated circuit chip package having an electrical contact configurable for either signal or power/ground and a method for constructing the integrated circuit chip package are disclosed. The integrated circuit chip package includes a substrate for supporting an integrated circuit chip and a dedicated conductor for supplying voltage to the integrated circuit chip. A configurable contact is attached to a surface of the substrate. The integrated circuit chip package further includes a signal connection for electrically connecting a signal connector of an integrated circuit chip and the configurable contact. A removable connector electrically connects the configurable contact and the dedicated conductor, thereby enabling the configurable contact to be configured as either a signal or power/ground contact depending upon the absence or presence of the electrical connection between the configurable contact and the dedicated conductor provided by the removable connector.

REFERENCES:
patent: 4628411 (1986-12-01), Balderes et al.
patent: 4975765 (1990-12-01), Ackermann et al.
patent: 5066831 (1991-11-01), Spielberger et al.
patent: 5334857 (1994-08-01), Mennitt et al.

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