Integrated circuit chip package for logic circuits

Details Integrated circuit chip package for logic circuits Integrated circuit chip package for logic circuits

1980-07-10

1983-08-09

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 72, 357 74, 357 80, 174 52H, H01L 2352, H01L 2336, H01L 2304, H01L 2312

Patent

active

043982085

ABSTRACT:
An integrated circuit (IC) chip package comprises a plurality of IC chips mounted on a multilayer substrate. A plurality of covers are provided on the substrate and are positioned so as to cover at least one of the IC chips. External pins are provided on each of the covers, and each of the pins is connected to selected chips via first signal lines on the covers connecting the pins to the substrate, and second signal lines within the substrate connecting the first signal lines to the selected chips. The substrate may be provided with a heat exchanger or heat sinks at the underside thereof, the overall construction resulting in a cool operating IC chip package with numerous external terminals having short wiring lengths to the chips.

REFERENCES:
patent: 3202888 (1965-08-01), Evander et al.
patent: 3311798 (1967-03-01), Gray
patent: 3361868 (1968-01-01), Bachman
patent: 3373322 (1968-03-01), Hillman et al.
patent: 3404214 (1968-09-01), Elliot
patent: 3404215 (1968-09-01), Burks et al.
patent: 3423638 (1969-01-01), Dix et al.
patent: 3496634 (1970-02-01), Kurtz et al.
patent: 3519895 (1970-07-01), Marino et al.
patent: 3649881 (1972-03-01), Chang et al.
patent: 4220917 (1980-09-01), McMahon, Jr.
Electronics, vol. 52, No. 4, Feb. 15, 1979, Anthony Durniak "IBM Has a Message: The 4300", pp. 85-86.
IEEE Transactions on Computers, vol. C-20, No. 12, Bernard S. Landman and Roy L. Russo, "On a Pin Versus Block Relationship for Partitions of Logic Graphs", pp. 1469-1479.

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