Integrated circuit chip package

Details Integrated circuit chip package Integrated circuit chip package

1985-09-12

1987-12-01

James, Andrew J.

357 72, 357 68, H01L 2302, H01L 2312, H01L 2348

Patent

active

047107987

ABSTRACT:
An integrated circuit is mounted on, and electrically connected to an underlying substrate by the flip-chip technique. In this technique, the chip is inverted and bonding pads on the chip are soldered to correspondingly located bonding pads on the substrate. By the invention a continuous ribbon or loop of solder or polymer extends between the chip and substrate surfaces and defines a sealed cavity. Because the interior of the cavity is sealed from contaminants, conducting leads of the chip or substrate can be left uncovered within the cavity so reducing the capacitance of high frequency circuits. The substrate can be a connection medium such as a printed circuit board or could be another integrated circuit chip.

REFERENCES:
patent: 3388301 (1968-06-01), James
patent: 3400383 (1968-09-01), Meadows et al.
patent: 3621564 (1971-11-01), Tanaka et al.
patent: 4074342 (1978-02-01), Honn et al.
patent: 4126879 (1978-11-01), Kessler et al.
"High Density, Low Temperature Solder Reflow Bonding of Silicon Chips to Plastic Substrates"--Kuhn et al.--IBM Tech. Disclosure Bulletin, vol. 18, No. 10, 3/1976.
"Active Silicon Chip Carrier"--Bodendorf et al.--IBM Tech. Disclosure Bulletin, vol. 15, No. 2, Jul. 1972, pp. 656-657.

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