Integrated circuit chip mounting and packaging assembly

Details Integrated circuit chip mounting and packaging assembly Integrated circuit chip mounting and packaging assembly

1986-03-25

1989-06-27

Grimley, Arthur T.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

357 74, H01L 2302

Patent

active

048431885

ABSTRACT:
An integrated circuit chip mounting and packaging assembly is described. The assembly comprises a spreader having one or more chips centrally mounted thereon. A plurality of leads are disposed outward of the integrated circuit chip on the same side of the spreader as the chip. When fully assembled, the spreader is positioned, chip side down, over a cavity in a printed circuit board-like substrate. The cavity is ringed with connectors which contact the spreader leads and appropriately connect the integrated circuit chip to other electronic components mounted on the substrate.

REFERENCES:
patent: 3404319 (1968-10-01), Tsuji et al.
patent: 3984620 (1976-10-01), Robillard et al.
patent: 4054938 (1977-10-01), Morris, Sr.
patent: 4150420 (1979-04-01), Berg
patent: 4285002 (1981-08-01), Campbell
patent: 4396935 (1983-08-01), Schuck
patent: 4517584 (1985-05-01), Matsushita et al.
patent: 4538210 (1985-08-01), Schaller
patent: 4618739 (1986-10-01), Theobold
"Plastics for Elecronics", Martin T. Goosey, Dynachem Corporation, Tustin, Calif., U.S.A., Elsevier Applied Science Publishers, 1985.

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