Integrated circuit chip module cleaning using a carbon dioxide j

Details Integrated circuit chip module cleaning using a carbon dioxide j Integrated circuit chip module cleaning using a carbon dioxide j

1997-02-14

1998-06-16

Soderquist, Arlen

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

134 2, 134 7, 134 254, 134 72, 134902, 438115, 438906, 451 38, 451 39, 451 75, 451 78, 451102, B08B 502

Patent

active

057663688

ABSTRACT:
A method of cleaning an integrated circuit chip module prior to attaching wire bonds thereto. The method involves disposing a module containing an integrated circuit chip and IC bond pads without wire bonds in an environmental process enclosure. A carbon dioxide jet spray cleaning system having a spray nozzle and orifice assembly is disposed the environmental process enclosure. A jet spray of carbon dioxide is generated using the jet spray cleaning system. The carbon dioxide jet spray is directed onto the surface of the module such that the spray impacts the IC bond pads and module bond pads to clean unwanted adhesive from the surface of the module and thus clean the IC and module bond pads.

REFERENCES:
patent: 5068040 (1991-11-01), Jackson
patent: 5364474 (1994-11-01), Williford, Jr.
patent: 5611491 (1997-03-01), Bowers

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