Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1986-03-03
1991-04-16
Abrams, Neil
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439 74, H05K 114
Patent
active
050078410
ABSTRACT:
An integrated-circuit (IC) chip packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board, without soldering, special tooling or special labor, and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips, without cable harnesses or back-panel wiring. The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it, and a number of connector elements in the form of compressible wads of conductive wire. The connector elements are disposed in selected openings in the insulating board and compressed into contact with the contact areas on the IC chips and IC chip packages. In a three-dimensional construction employing the principles of the invention, the IC chips are arranged in modules, and interconnections may be made between IC chips within each module, transversely between modules, and in a third direction between layers of modules.
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Abrams Neil
Steinberger James M.
Taylor Ronald L.
TRW Inc.
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