Integrated circuit chip handling apparatus and method

Details Integrated circuit chip handling apparatus and method Integrated circuit chip handling apparatus and method

2005-06-14

2005-06-14

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S593000, C029S741000, C029S719000

Reexamination Certificate

active

06904671

ABSTRACT:
The present invention provides for an apparatus and method for handling integrated circuit (IC) chips such as thin small outline package (TSOP) IC chips. Embodiments of the invention are directed toward removal of TSOPs from device under test (DUT) boards. By use of magnetic forces generated by the invention, in combination with physical manipulation of the DUT boards and transfer structures, IC chips are quickly and efficiently transferred.

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