Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-07-12
2011-07-12
Richards, N Drew (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257SE23079
Reexamination Certificate
active
07977801
ABSTRACT:
A multi-chip module and an integrated structure of the present invention including: at least one of either a terminal unit formation area expanded type integrated circuit chip, or a terminal unit formation area identical type integrated circuit chip; terminal unit formation areas of these integrated circuits that are covered with protective layers, and expanded wiring units and terminal units formed in the protective layers; one or a plurality of the terminal unit formation area expanded type and the terminal unit formation area identical type integrated circuit chip components that are two-dimensionally or three-dimensionally aligned in further protective layers; a horizontal or a vertical wiring formed for arbitrarily connecting the plurality of the integrated circuit chip components in the further protective layers.
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Lackenbach & Siegel LLP
Richards N Drew
Takatsuki Ryo
Trinh Hoa B
Young, Esq. Andrew F.
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