Geometrical instruments
Patent
1982-07-06
1984-07-10
Desmond, Eugene F.
Geometrical instruments
339 75M, 339174, 339176M, 174 52FP, H05K 112
Patent
active
044589689
ABSTRACT:
An arrangement for the solderless mounting of a leadless integrated circuit chip carrier (13) on a printed wiring board (10). A contact interface element (20) presents an array of electrically conductive annular springs (27) which electrically connect the contact pads (14) of the chip carrier (13) and the contact pads (15) of the printed wiring board (10) is interposed between the carrier (13) and the board (10). The interface element (20) is fitted about a locating block (32) affixed to the board (10), the block (32) having a central aperture (33) dimensioned to freely admit a central pin (36) extending from the underside of the chip carrier (13). The latter component is held in place by a retaining ring (39) frictionally fitted to the pin (36) and operating against a collar (37) through which the pin (36) also passes, which collar (37) is press-fitted into the locating block (32).
REFERENCES:
patent: 3795884 (1974-03-01), Kotaka
patent: 3960423 (1976-06-01), Weisenberger
patent: 4050755 (1977-09-01), Hasircoglu
patent: 4089575 (1978-05-01), Grabbe
patent: 4109378 (1978-08-01), Davies
patent: 4130327 (1978-12-01), Spaulding
patent: 4144648 (1979-03-01), Grovender
patent: 4334727 (1982-06-01), Scheingold et al.
patent: 4390220 (1983-06-01), Benasutti
AT&T Bell Laboratories
Bishop Steven C.
Desmond Eugene F.
Kamstra W. H.
Watland R. T.
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