Integrated circuit chip carrier mounting arrangement

Details Integrated circuit chip carrier mounting arrangement Integrated circuit chip carrier mounting arrangement

1982-07-06

1985-03-26

Bilinsky, Z. R.

Geometrical instruments

324158F, 339 75M, 339176M, H05K 112

Patent

active

045069387

ABSTRACT:
An arrangement for the solderless mounting of an integrated circuit chip carrier (13) on a printed wiring board (10). A socket (16), cemented to the board, is provided within which a leadless chip carrier (13) is fitted. Featured is a contact interface element (20) which presents an array of electrically conductive annular springs (27) which electrically connect the contact pads (14) of the chip carrier (13) and the contact pads (15) of the printed wiring board (10). The interface element (20) is clamped between the chip carrier (13) and the printed wiring board (10) by means of a compression spring (31) operating on the upper surface of the chip carrier (13).

REFERENCES:
patent: 3795884 (1974-03-01), Kotaka
patent: 3951493 (1976-04-01), Kozel et al.
patent: 3960423 (1976-06-01), Weisenburger
patent: 4050755 (1977-09-01), Hasircoglu
patent: 4089575 (1978-05-01), Grabbe
patent: 4109378 (1978-08-01), Davies
patent: 4130327 (1978-12-01), Spaulding
patent: 4144648 (1979-03-01), Grovender
patent: 4334727 (1982-06-01), Scheingold et al.
patent: 4341433 (1982-07-01), Cherian et al.
patent: 4390220 (1983-06-01), Benasutti

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