Integrated circuit chip carrier

Details Integrated circuit chip carrier Integrated circuit chip carrier

1985-05-16

1987-07-21

Grimley, Arthur T.

Electricity: electrical systems and devices

Miscellaneous

174 52FP, 357 80, 361400, H05K 118

Patent

active

046822704

ABSTRACT:
A chip carrier includes a body (1) having a central region and sidewalls (31) connected to the central region by an elastically deformable region (33), in order to reduce thermal strains.
Also for the same reason a heat sink (41) may be attached underneath the carrier below the carrier's die attachment site (8) and thermally conductive material (40,42) may connect them together. The heat sink may be used for mechanical anchorage.
The chip carrier may be produced by injection moulding from an aromatic thermoplastic polymer.
A carrier may be moulded with more than one die attachment site or a circuit board with die attachment sites could be moulded, preferably with the die attachment site recessed so that the surface of the die 9 is co-planar with conductive tracks on the board.

REFERENCES:
patent: 3471753 (1969-10-01), Burks et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4451845 (1984-05-01), Philofsky
patent: 4463217 (1984-07-01), Orcutt
patent: 4554404 (1988-11-01), Gilder, Jr. et al.
ICI Publication `Victrex` Polyethersulphone.
Electronics Dec. 15, 1982, pp. 155-158.
Welwyn Electric Ltd. Newsletter, Feb. 83.

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