Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2011-07-19
2011-07-19
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23105, C257SE23101, C257SE23092, C257S734000, C257S737000, C257S778000, C257S783000, C257S774000, C257S773000, C257S680000, C257S713000, C257S717000, C257S720000, C257S675000
Reexamination Certificate
active
07982307
ABSTRACT:
An assembly comprises a stiffener, a circuit substrate and an IC chip. The stiffener has a surface with a first region and a second region. The circuit substrate covers at least a portion of the first region of the stiffener, while the IC chip overlies at least a portion of each of the first and second regions of the stiffener. The assembly further comprises a signal solder bump and a thermally conductive feature. The signal solder bump contacts the IC chip and the circuit substrate. The thermally conductive feature is disposed between, and is metallurgically bonded to, the integrated circuit chip and the second region of the stiffener. The thermally conductive feature provides an efficient thermal conductivity pathway between the IC chip and the stiffener.
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Amin Ahmed
Crouthamel David L.
Osenbach John W.
Shilling Thomas H.
Vaccaro Brian T.
Agere Systems Inc.
Ryan & Mason & Lewis, LLP
Williams Alexander O
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