Integrated circuit chip-and-substrate assembly

Details Integrated circuit chip-and-substrate assembly Integrated circuit chip-and-substrate assembly

1984-02-17

1987-06-02

James, Andrew J.

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 55, 357 56, 357 68, 357 74, 357 75, 361403, 1566591, H01L 2904

Patent

active

046707700

ABSTRACT:
In the interest of enhanced yield in the manufacture of "wafer-scale" integrated circuits an assembly of integrated circuit chips is made by placing chips on a substrate. Chips have beveled edges as produced by crystallographically anisotropic chemical etching, and the substrate has wells, grooves, or openings having sloping walls. Chips are positioned on the substrate by bringing sloping walls and beveled edges in juxtaposition, and circuitry on chips is connected to circuitry on the substrate.

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