Integrated circuit chip and method for cooling an integrated...

Details Integrated circuit chip and method for cooling an integrated... Integrated circuit chip and method for cooling an integrated...

2005-08-05

2008-08-12

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257SE23103, C257SE23098, C257S714000, C257S722000, C361S703000, C438S125000

Reexamination Certificate

active

07411290

ABSTRACT:
An integrated circuit chip is provided, the integrated circuit chip having: a base portion, the base portion having a peripheral wall forming an elevated perimeter depending away from a surface of the base potion; a plurality of extensions extending away from the surface, a periphery of each of the plurality of extensions being spaced away from the peripheral wall, the plurality of extensions further comprising a first group of extensions and a second group of extensions, each of the first group of extensions having a greater peripheral area than a peripheral area of each of the second group of extensions and the first group of extensions being aligned with a portion of an integrated circuit disposed on another surface of the base, the portion of the integrated circuit generating a higher heat flux than other portions of the integrated circuit, and a plate secured to the elevated perimeter, the plate the plate covering the plurality of extensions and further comprising an inlet opening and an outlet opening.

REFERENCES:
patent: 2997510 (1961-08-01), Gier, Jr.
patent: 3204425 (1965-09-01), Rush
patent: 7177536 (2007-02-01), Natsuhara et al.

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