Integrated circuit chip and integrated device

Details Integrated circuit chip and integrated device Integrated circuit chip and integrated device

2005-07-29

2008-11-25

Coleman, W. David (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257SE23020

Reexamination Certificate

active

07456505

ABSTRACT:
Embodiments provide for integrated circuit chip and device having such an integrated circuit, in which different types of pads are arranged in separate rows. In one embodiment the pads are arranged to reduce the loop inductance of corresponding signal and power supply bond wires.

REFERENCES:
patent: 6064113 (2000-05-01), Kirkman
patent: 6221690 (2001-04-01), Taniguchi et al.
patent: 6538336 (2003-03-01), Secker et al.
patent: 6667546 (2003-12-01), Huang et al.
patent: 2003/0075812 (2003-04-01), Cheng et al.
patent: 2005/0045987 (2005-03-01), Koo et al.
patent: 2005/0098870 (2005-05-01), Thomas et al.
patent: 2005/0200009 (2005-09-01), Kang et al.
patent: 196 31 046 (1998-02-01), None

Affiliated with

Also associated with

Rating

Integrated circuit chip and integrated device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit chip and integrated device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit chip and integrated device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4050095