Integrated circuit carrier

Details Integrated circuit carrier Integrated circuit carrier

1992-12-31

1994-03-08

Abrams, Neil

Electrical connectors

Aligning means for dual inline package

439 70, H05K 100

Patent

active

052922669

ABSTRACT:
An electrical conductive pattern is deposited on the surface of a frame constituting an integrated circuit carrier. To enable leads extending from an integrated circuit package to come in contact with the electrical conductive pattern, a plurality of first contact portions are formed on the inner end of the electrical conductive pattern. In addition, to enable a plurality of contact pieces extending from an integrated circuit socket to come in contact with the conductive pattern, a plurality of second contact portions are formed on the outer end of the electrical conductive pattern. Thus, the leads extending from the integrated circuit package are reliably brought into electrical contact with the contact pieces via the first contact portions, the electrical conductive pattern and the second contact portions. The arrangement of the electrical conductive pattern in that way makes it possible that the leads can be spaced from each other at an interval smaller than an interval between adjacent contact pieces.

REFERENCES:
patent: 3407925 (1968-10-01), Ruehlemann
patent: 3529277 (1970-09-01), Barnes
patent: 3652974 (1972-03-01), Tems
patent: 4236777 (1980-12-01), Merlina et al.
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4918513 (1990-04-01), Kurose et al.

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