Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1996-07-29
1997-10-28
Phillips, Michael W.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, H05K 118
Patent
active
056822936
ABSTRACT:
A reinforcement structure to protect an integrated circuit module located within a smart card. The integrated circuit module is positioned in a cavity formed in a first surface of the smart card. The reinforcement structure, which has a modulus of elasticity higher than the modulus of elasticity of the smart card, is positioned in a cavity formed in a second surface of the smart card. The first and second surfaces of the smart card are opposing surfaces of the smart card. The reinforcement structure can have various shapes. In addition, the reinforcement structure can be substantially planar, or can have flanges. An additional layer can be formed over the first surface to enclose the integrated circuit module. The reinforcement structure relieves stress on the integrated circuit module during bending and torsion of the card.
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Horejs, Jr. Charles F.
Templeton, Jr. Thomas H.
Hoffman E. Eric
MacPherson Alan H.
Phillips Michael W.
US3, Inc.
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