Integrated circuit capable of operating at different supply...

Details Integrated circuit capable of operating at different supply... Integrated circuit capable of operating at different supply...

2006-12-26

2011-10-25

Berhane, Adolf (Department: 2838)

Electric power conversion systems

Current conversion

Integrated circuit

Reexamination Certificate

active

08045353

ABSTRACT:
A chip configuration for dual board voltage compatibility comprising ballast I/O pads, regulator control block and VDDCO pad. If 1.8V is available on board, all 1.8V pads are connected to the package pins and the VDDCO pad is double bonded with one 1.8V package pin. This ensures that the regulator is in operation providing 1.2V supply to the core. If 1.2V is available on board, all 1.2V pads are bonded to the package pins and VDDCO pad is left unbonded. A weak pulldown ensures that the regulator is inoperational and the gate voltage of ballast transistor is pulled up. Now 1.2V pads directly get supply from the board through package pins and is provided to the core without suffering IR drop.

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