Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1998-09-17
2001-11-20
Picard, Leo P. (Department: 2841)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S761000, C361S777000, C174S050510, C174S255000, C174S260000, C257S531000, C257S679000, C029S840000, C029S841000
Reexamination Certificate
active
06320753
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to an integrated circuit board device and a process for manufacturing such a board. More precisely, it relates to an integrated circuit board which operates both using data transmitted by contacts or using data transmitted by an antenna, i.e. without contacts.
DESCRIPTION OF THE PRIOR ART
A board is already known which operates using both data transmitted by contacts or using data transmitted without contacts. European patent EP 0706152 mentions such a board. It is provided with two integrated circuits: one is employed for use of the board via contacts, the other is employed for use of the board without contacts, via an antenna. The disadvantage of such a board is the cost due to the use and construction of two integrated circuits.
A board is also known which only employs a single integrated circuit and which operates both using data transmitted via contacts or data transmitted without contacts. U.S. Pat. No. 5,598,032 describes such a board. It has a module which supports the integrated circuit. This module consists of external contact zones separated by insulators and of an integrated circuit fixed above them. Connections are necessary between the integrated circuit and the external contact zones; they are generally provided by wires. The module has other connections which connect the integrated circuit to the antenna. One disadvantage of such a board is linked to the fact that such a module can be removed without destruction of its support and may thus be used fraudulently. Another disadvantage arises from the complexity of manufacture of a module: this involves a high cost.
SUMMARY OF THE INVENTION
More precisely, the invention relates to an integrated circuit board comprising a support, a strip fixed onto the support, a cavity at least partially defined in the support and/or the strip, an integrated circuit provided with connection ends and arranged in the said cavity, an antenna provided with connection terminals and arranged between the said support and the said strip, and external contact zones connected to other connection terminals, the said integrated circuit being connected both to the antenna and to the external contact zones, characterised by the fact that the above-mentioned connection terminals are arranged opposite corresponding connection ends of the integrated circuit and are respectively connected to them.
The invention improves the embedding of the integrated circuit in a board to prevent fraudulent use. The invention permits the manufacturing cost of such a board to be reduced by arranging and directly connecting the integrated circuit on the board. It also simplifies the manufacture of such a board. The advantages will become more clearly apparent in the course of the following description.
The support and the strip generally consist of a thermoplastic material. The above-mentioned cavity may be formed in the support or in the strip or may also be defined in the assembly consisting of the support and the strip. This cavity may consist of a space between the support and the strip. This cavity is intended to house an integrated circuit. This integrated circuit is provided with connection ends. An antenna, provided with connection terminals, is arranged between the support and the strip. This allows the antenna to be protected and its appearance to be avoided. External contact zones gather data by contact. These external contact zones may advantageously be irremovably embedded in the board. They are connected to connection terminals, which connect the external contact zones to the integrated circuit. The integrated circuit is connected both to the antenna, by means of the antenna connection terminals, and to the external contact zones, by means of the connection terminals connected to the external contact zones. These connection terminals are arranged opposite the corresponding connection ends of the integrated circuit and are connected to the corresponding connection ends of the integrated circuit. This feature of the assembly avoids production of a module; it also avoids connection wires between the external connection zones and the connection ends. The assembly of connection terminals is connected directly to the corresponding connection ends of the integrated circuit, optionally with interposition of conductive excrescences as will be seen below.
The antenna may have various configurations. It may be an electromagnetic coil. It may thus in particular include turns: in this case the antenna may be passed under the integrated circuit defining a grouping of the connection terminals connected to the external contact zones in two assemblies such that the turns pass between the said two assemblies. This configuration avoids passing an antenna connection over the turns. Constriction of the turns may be necessary at the passage of the turns between the two assemblies of connection terminals. The antenna may, for example, be produced by hot-stamping, or by deposition of a wire of conductive material, or by silk-screen printing of a conductive ink or a conductive resin, or by photogravure or tampography. Hot-stamping is particularly described in European patent EP 0 063 347. A groove may be formed to contain the antenna. This groove may be formed in the support, or in the strip, or in the assembly consisting of the support and the strip.
The external contact zones are preferably formed by hot-stamping. Most frequently connection tracks connect the external contact zones to the respective connection terminals; in this case the external contact zones, the connection terminals of the external contact zones and the connection tracks may be produced at the same time, for example by hot-stamping.
The integrated circuit is irremovably firmly fixed in the cavity. To achieve this, the integrated circuit is generally bonded. An anisotropic adhesive may be used; it also facilitates the connection between the connection terminals and the connection ends of the integrated circuit. An insulating adhesive may also be used; it allows good isolation of the different conductive elements which are not intended to be connected.
A conductive adhesive deposited on at least certain connection ends of the integrated circuit and/or certain connection terminals also permits fixing and connection of the integrated circuit.
Conductive excrescences may be present on at least certain of the connection ends of the integrated circuit and/or on certain of the connection terminals; they facilitate connection between the connection ends of the integrated circuit and the corresponding connection terminals. When insulating adhesive is used, application of the integrated circuit with a controlled pressure drives the adhesive to the contact points, particularly in the presence of conductive excrescences; a good connection is thus obtained between the connection terminals and the connection ends of the integrated circuit, optionally via conductive excrescences. When anisotropic adhesive is used, squeezing of the adhesive at the contact points permits good electrical connection, in particular in the presence of conductive excrescences. These conductive excrescences are formed of a conductive material, for example metal or conductive adhesive. A conductive adhesive may also be deposited on at least certain conductive excrescences, to effect the connections.
A protective resin arranged on or around the integrated circuit protects the latter.
In accordance with an embodiment of the invention, the external contact zones and the connection terminals of the said external contact zones may by arranged on the strip. It may be advantageous, particularly in this embodiment, to use two or more conductive excrescences superimposed between connection ends and corresponding connection terminals; this facilitates connection between the said connection ends and the said corresponding connection terminals when the distance between these corresponding elements, which are to be connected, is large.
In accordance with a further embodiment, the external contact zones and
Foster David
Oberthur Card Systems SA
Oliff & Berridg,e PLC
Picard Leo P.
LandOfFree
Integrated circuit board combining external contact zones... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit board combining external contact zones..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit board combining external contact zones... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2581732