Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of...
Reexamination Certificate
2006-09-19
2009-11-10
Nguyen, Dao H (Department: 2818)
Semiconductor device manufacturing: process
Forming bipolar transistor by formation or alteration of...
C438S318000, C438S320000, C438S337000, C438S339000, C438S360000, C257S198000, C257S588000, C257S592000, C257S593000, C257SE21371, C257SE21379, C257SE29193
Reexamination Certificate
active
07615455
ABSTRACT:
A bipolar transistor having a base region resting by its lower surface on a collector region and surrounded with a first insulating layer, a base contact conductive region in contact with an external upper peripheral region of the base region, a second insulating region in contact with an intermediary upper peripheral region of the base region, an emitter region in contact with the central portion of the base region. The level of the central portion is higher than the level of the intermediary portion.
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French Search Report from corresponding French Application No. 0552818, filed Sep. 20, 2005.
Chevalier, P. et al., 180 GHzft and fmax Self-Alligned SiGeC HBT Using Selective Epitaxial Growth of the Base, European Solid-State Device Research, 2003 33rdConference on ESSDERC '03, Sep. 16-18, 2003, Piscataway, NJ, IEEE, Sep. 16, 2003, pp. 299-302, XP010676656.
Chantre Alain
Chevalier Pascal
Jorgenson Lisa K.
Morris James H.
Nguyen Dao H
STMicroelectronics S.A.
Wolf Greenfield & Sacks P.C.
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