Integrated circuit assembly with polymeric underfill body

Details Integrated circuit assembly with polymeric underfill body Integrated circuit assembly with polymeric underfill body

1995-07-05

1997-08-05

Ryan, Patrick

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428355, 428344, 252 623T, 252 623Q, 523211, 525 95, 525119, 525122, 525476, 525531, B32B 900

Patent

active

056540817

ABSTRACT:
In a method of producing an integrated circuit assembly, an IC device is metallurgically bonded to a supporting substrate. The mounting of the IC device to the substrate also includes a polymeric underfill body adhesively bonding the IC device to the substrate. The polymeric underfill body is formed of a curable underfill composition comprising epoxy resin, anhydride curing agent for the epoxy resin, amine catalyst and a minor amount of an additional component selected from alkyl-substituted imidazole and phenyl-substituted imidazole. Such additional component may act as a catalyst, as used with an amine catalyst known catalyst for the polymerization reaction of the epoxy resin with the anhydride curing agent, may act as a co-catalyst. The polymeric underfill body has improved glass transition temperature values and improved coefficient of thermal expansion values to provide good thermal stress cycling life for the integrated circuit assembly. The additional component, such as N-methyl-imidazole, is used in minor amount, such as from 0.05 to 5.0 weight percent.

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