Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1996-03-21
1998-02-03
Thomas, Tom
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257700, 257792, 257777, 257686, 257692, 257668, H01L 2348, H01L 2312, H01L 2314, H01L 2332
Patent
active
057148007
ABSTRACT:
A method of forming an integrated circuit assembly having a stepped interposer (300), an integrated circuit die (200) and an encapsulant (500). The stepped interposer (300) includes a central portion (320) having a plurality of contact regions (360), and a peripheral region (330), completely surrounding the central region (320), having a plurality of bonding regions (350). Some of the contact regions (360) are electrically coupled to some of the bonding regions (350). The integrated circuit die (200) includes a plurality of bonding pads (210) located around its periphery. The stepped interposer (300) is fixably coupled to the integrated circuit die (200) and some of the bonding pads (210) are electrically coupled to some of the bonding regions (350). The stepped interposer (300) of the present invention provides contact regions (360) free from encapsulant (500) and added protection for wirebonds (400) or any other means of electrical coupling.
REFERENCES:
patent: 5081563 (1992-01-01), Feng et al.
patent: 5126813 (1992-06-01), Takahashi et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5148266 (1992-09-01), Khandros et al.
patent: 5227232 (1993-07-01), Lim
patent: 5258330 (1993-11-01), Khandros et al.
patent: 5315486 (1994-05-01), Fillion et al.
patent: 5319241 (1994-06-01), Lim
patent: 5381047 (1995-01-01), Kanno
patent: 5402318 (1995-03-01), Otsuka et al.
patent: 5412247 (1995-05-01), Martin
patent: 5414298 (1995-05-01), Grube et al.
patent: 5463246 (1995-10-01), Matsunami et al.
patent: 5491362 (1996-02-01), Hamzehdoost et al.
patent: 5528075 (1996-06-01), Burns
Dover Rennie William
Motorola Inc.
Thomas Tom
Williams Alexander Oscar
LandOfFree
Integrated circuit assembly having a stepped interposer and meth does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit assembly having a stepped interposer and meth, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit assembly having a stepped interposer and meth will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-665327