Wave transmission lines and networks – Coupling networks – With impedance matching
Patent
1996-10-10
1998-07-07
Gensler, Paul
Wave transmission lines and networks
Coupling networks
With impedance matching
287664, 333247, 34082586, H01P 500
Patent
active
057775290
ABSTRACT:
An integrated circuit assembly and a method for distributed broadcasting of high speed chip input signals to a series of on-chip destination cells is provided, which eliminates the need for input buffers. A bufferless distributed broadcasting path is provided by matching the impedances off-chip conductive trace, i.e. a package trace, which together with interface circuitry forms a first transmission line, and on-chip conductive traces which form a second transmission line, to provide a constant impedance transmission line extending from a package trace to the far end of the on-chip trace. The method of bufferless distributed circuit (BDC) broadcasting is applicable to chip designs such as a crosspoint switch, parallel multiplier and distributed amplifier, and provides advantages of lower signal delay and power dissipation. In an experimental GaAs HBT 8.times.4 crosspoint switch, BDC broadcasting was found to achieve a significant power savings with negligible penalty in jitter or bit error rate performance at a 10 Gb/s data rate.
REFERENCES:
patent: 4595881 (1986-06-01), Kanaan
patent: 4845440 (1989-07-01), Aitchison
patent: 4908529 (1990-05-01), Aitchison
patent: 4991001 (1991-02-01), Takubo et al.
patent: 5021759 (1991-06-01), Gamand et al.
patent: 5334962 (1994-08-01), Higgins et al.
patent: 5365197 (1994-11-01), Ikalainen
patent: 5373187 (1994-12-01), Sugino et al.
patent: 5376909 (1994-12-01), Nelson et al.
patent: 5475679 (1994-12-01), Munter
patent: 5499239 (1996-03-01), Munter
patent: 5519350 (1996-05-01), Diodato et al.
Shin et al., in "An experimental experimental 5 Gb/s 16.times.16 Si-bolar crosspoint switch", IEEE J. Solid State Circuits, vol. 27, No. 12, Dec. 1992.
Savara et al., in "A 2.5 Gb/s 16.times.16 crosspoint switch with fast programming", 1995 IEEE BaAs IC Symposium Abstracts, pp. 47-48.
T.Y. Wong, et al., in an article entitled "A Gb/s AlGaAs HBT high power fully differential limiting distributed amplifier for III-V Mach-Zehnder modulator" in GaAs IC Symp. Dig. Tech. Papers, pp. 201-204, 1995.
T.Y. Wong in "Fundamentals of distributed Amplification", Chapter 1, pp. 1-13 (Artech House 1993).
T. Lester et al., in "A manufacturable process for HBT circuits" in Proc. IOP Int. Symp. on GaAs and Related compounds, pp. 449-454, 1993.
Stitch et al., in an article entitled "The use of III-V Ics in WDM Optical network Equipment" GaAs IC Symp. Digest Tech. Papers, pp. 177-180, 1995.
de Wilton Angela C.
Gensler Paul
Northern Telecom Limited
LandOfFree
Integrated circuit assembly for distributed broadcasting of high does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Integrated circuit assembly for distributed broadcasting of high, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit assembly for distributed broadcasting of high will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1210323