Integrated circuit assembly and method of assembly

Details Integrated circuit assembly and method of assembly Integrated circuit assembly and method of assembly

1998-09-11

2000-07-25

Swann, Glen

Communications: electrical

Condition responsive indicating system

Specific condition

29 2501, 295921, 29601, 29DIG1, 34082534, 34082554, G08B 13181

Patent

active

060941383

ABSTRACT:
An integrated circuit assembly (12) such as used on a radio frequency identification tag, or other device, includes an integrated circuit (14) coupled to first and second printed conductors (16a) and (16b), such as tag electrodes, on a flexible substrate (18). The printed conductors (16a and 16b) may be conductors in the form of printed ink electrostatic antennas. The integrated circuit (14), is disposed in a generally co-planar arrangement with the flexible substrate (18). That is, the integrated circuit (14) is positioned in-line with the flexible substrate (18).

REFERENCES:
patent: 5528222 (1996-06-01), Mokowitz et al.
patent: 5786626 (1998-07-01), Brady et al.

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