Integrated circuit assembly

Details Integrated circuit assembly Integrated circuit assembly

2002-12-12

2009-06-23

Chu, Chris C. (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257SE23175, C257S734000, C257S776000, C361S760000, C361S761000, C174S260000

Reexamination Certificate

active

07550842

ABSTRACT:
In an integrated circuit assembly, know good die (KGD) are assembled on a substrate. Interconnect elements electrically connect pads on a die attached to the substrate to traces or other electrical conductors on the substrate or to pads on another die attached to the substrate. The substrate may have one or more openings, exposing pads of the die. The assembly may comprise one or more dice.

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