Integrated circuit arrangement and method for the...

Details Integrated circuit arrangement and method for the... Integrated circuit arrangement and method for the...

2005-07-05

2005-07-05

Fourson, George (Department: 2823)

Semiconductor device manufacturing: process

Making passive device

Resistor

C257S358000

Reexamination Certificate

active

06913983

ABSTRACT:
A doped region is provided on a substrate. A plane with conductive useful structures and a conductive filler structure is arranged at the surface of the substrate. The conductive filler structure is conductively connected to the doped region. In this way, charging of the conductive filler structure, which is provided for improving the planarity of the circuit arrangement and has no circuit-oriented function, is avoided.

REFERENCES:
patent: 4590508 (1986-05-01), Hirakawa et al.
patent: 4832789 (1989-05-01), Cochran et al.
patent: 4945067 (1990-07-01), Huang
patent: 5416343 (1995-05-01), Slotboom et al.
patent: 5441915 (1995-08-01), Lee
patent: 5521113 (1996-05-01), Hsue et al.
patent: 5698902 (1997-12-01), Uehara et al.
patent: 5714410 (1998-02-01), Kim
patent: 5731234 (1998-03-01), Chen
patent: 5736421 (1998-04-01), Shimomura et al.
patent: 5866449 (1999-02-01), Liaw et al.
patent: 5869396 (1999-02-01), Pan et al.
patent: 5960270 (1999-09-01), Misra et al.
patent: 5994179 (1999-11-01), Masuoka
patent: 6069036 (2000-05-01), Kim
patent: 6074938 (2000-06-01), Asamura
patent: 6204137 (2001-03-01), Teo et al.
patent: 6207543 (2001-03-01), Harvey et al.
patent: 6236101 (2001-05-01), Erdeljac et al.
patent: 6300653 (2001-10-01), Pan
patent: 0 661 744 (1995-07-01), None
patent: 08-236767 (1996-09-01), None
D. Widmann, et al., “Technologie hochintegrierter Schaltungen”, 2d. Edition, Springer Verlag, pp. 346-347, 1007.

Affiliated with

Also associated with

Rating

Integrated circuit arrangement and method for the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated circuit arrangement and method for the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated circuit arrangement and method for the... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3397728