Integrated circuit apparatus, systems, and methods

Details Integrated circuit apparatus, systems, and methods Integrated circuit apparatus, systems, and methods

2011-08-16

2011-08-16

Lin, Sun J (Department: 2825)

Computer-aided design and analysis of circuits and semiconductor

Integrated circuit design processing

Physical design processing

C716S130000

Reexamination Certificate

active

08001513

ABSTRACT:
High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.

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