Integrated circuit and method for manufacturing an...

Semiconductor device manufacturing: process – Forming bipolar transistor by formation or alteration of... – Forming lateral transistor structure

Reexamination Certificate

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C438S334000, C438S336000, C438S343000, C438S357000

Reexamination Certificate

active

07320922

ABSTRACT:
An integrated circuit on a semiconductor chip is provided with a first bipolar transistor and a second bipolar transistor. The first bipolar transistor has a first collector region of a first conductivity type, grown by at least one epitaxial layer, and the second bipolar transistor has a second collector region of this first conductivity type grown by this epitaxial layer. The first collector region also has a first collector drift zone, and the second collector region has a second collector drift zone. Whereby, the first collector drift zone is shortened as compared to the second collector drift zone by partial etching of the epitaxial layer.

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