Integrated circuit and lead frame assembly

Details Integrated circuit and lead frame assembly Integrated circuit and lead frame assembly

1990-07-05

1993-12-07

Gregory, Bernarr E.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257673, 257690, 257700, H01L 2348

Patent

active

H00012670

ABSTRACT:
An integrated circuit (IC) and lead frame assembly comprises a first TAB segment having a plurality of leads having inner and outer ends. The inner ends are connected to bumps formed in a square pattern adjacent the periphery of the IC. A second TAB segment includes a plurality of leads having inner and outer ends. The inner ends are connected to a second set of bumps formed on the IC inwardly from the first set. The outer ends of the leads on the second TAB segment are connected to traces on the first TAB segment which are interleaved between the leads on the first TAB segment. The outer ends of the traces and leads on the first TAB segment thus connect to all of the IC bumps. This arrangement increases the number of connections which can be made to the IC.

REFERENCES:
patent: 3902148 (1975-08-01), Drees et al.
patent: 4078980 (1978-03-01), Harris et al.
patent: 4120759 (1978-10-01), Asami et al.
patent: 4209355 (1980-06-01), Burns
patent: 4510017 (1985-04-01), Barber
patent: 4613891 (1986-09-01), Ng et al.
patent: 4647959 (1987-03-01), Smith
patent: 4714517 (1987-12-01), Malladi et al.
patent: 4941033 (1990-07-01), Kishida

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