Integrated circuit, and a mobile phone having the integrated...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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C361S770000, C361S774000

Reexamination Certificate

active

07961478

ABSTRACT:
In an example embodiment, an integrated circuit comprises an on-chip electronic component. The on-chip electronic component has an active surface in a hermetically sealed cavity and a cover to hermetically seal the cavity. There is an additional electronic component wherein the additional electronic component is fixed on the cover.

REFERENCES:
patent: 5802458 (1998-09-01), Van Zeijl et al.
patent: 5903049 (1999-05-01), Mori
patent: 6329739 (2001-12-01), Sawano
patent: 6472741 (2002-10-01), Chen et al.
patent: 6734605 (2004-05-01), Kinoshita
patent: 6737750 (2004-05-01), Hoffman et al.
patent: 6787916 (2004-09-01), Halahan
patent: 7064426 (2006-06-01), Karnezos
patent: 7163842 (2007-01-01), Karnezos
patent: 7242101 (2007-07-01), Ararao et al.
patent: 2002/0135269 (2002-09-01), Kinoshita
patent: 2003/0169575 (2003-09-01), Ikuta et al.
patent: 2004/0029356 (2004-02-01), Timme et al.
patent: 2004/0232802 (2004-11-01), Koshido
patent: 1 184 979 (2002-03-01), None
patent: WO 2004/012331 (2004-02-01), None

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