Integrated chassis and resonance component in an electronic devi

Details Integrated chassis and resonance component in an electronic devi Integrated chassis and resonance component in an electronic devi

1997-07-24

1998-09-01

Tran, Sinh

Electrical audio signal processing systems and devices

Electro-acoustic audio transducer

381160, 381205, H04R 2500

Patent

active

058021884

ABSTRACT:
An electronic device includes an electronic component and a chassis to support the electronic component. The electronic device also includes a non-supporting chassis component that is integrally formed along with and as part of the chassis. The non-supporting chassis component is functionally operable in cooperation with the electronic component to enhance performance of the electronic component. In one example, the electronic component is an electronic speaker and the non-supporting chassis component is a resonance chamber positioned adjacent to the speaker to improve the speaker's sound qualities. The chassis and non-supporting chassis component (i.e., the resonance chamber) are integrally formed together via a single injection molding process using expanded polypropylene.

REFERENCES:
patent: 5097513 (1992-03-01), Jordan et al.
patent: 5524062 (1996-06-01), Oh
Robert Cole, "Fast Fabrication With Foam Chassis", Machine Design, Mar. 9, 1995, pp. 115-120.

Affiliated with

Also associated with

Rating

Integrated chassis and resonance component in an electronic devi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Integrated chassis and resonance component in an electronic devi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Integrated chassis and resonance component in an electronic devi will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-278205