Integrated capacitor on packaging substrate

Details Integrated capacitor on packaging substrate Integrated capacitor on packaging substrate

2007-04-03

2007-04-03

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Integrated circuit structure with electrically isolated...

Passive components in ics

C257S299000, C257S309000, C257S532000, C257SE21018, C257SE21011

Reexamination Certificate

active

11183864

ABSTRACT:
An integrated capacitor on a packaging substrate. The integrated capacitor comprises a conductor plane, a first dielectric layer and a signal transmission layer. The conductor plane has an extrusion layer of a first thickness. The first extrusion layer and the conductor plane are made of the same material. The first dielectric layer is formed on the conductor plane. The signal transmission layer is formed on the first dielectric layer.

REFERENCES:
patent: 5350707 (1994-09-01), Ko et al.
patent: 6033953 (2000-03-01), Aoki et al.
patent: 6115233 (2000-09-01), Seliskar et al.
patent: 6504236 (2003-01-01), Bissey

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