Integrated capacitor and method of fabricating same

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437 47, 437 52, 437919, H01L 21265, H01L 2994

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048267791

ABSTRACT:
An integrated capacitor having an oxide layer of less than 500 .ANG. as a dielectric or insulator. A method of fabricating a capacitor including the steps of forming an oxide layer on a substrate, forming through the oxide layer a first capacitor plate in the substrate, and forming a second capacitor plate on the oxide layer. The method also includes the step of restructuring the oxide layer after the step of forming the first capacitor plate. Since the first capacitor plate is formed through the oxide layer the oxide layer can be grown on an undoped or lightly doped substrate; thus, the effects of the doping level on the growth rate of the oxide layer are eliminated and oxide layers having a uniform thickness of less than 500 .ANG. can consistently be provided.

REFERENCES:
patent: 3696276 (1972-10-01), Boland
patent: 3893146 (1975-07-01), Heeren
patent: 4042945 (1977-08-01), Lin et al.
patent: 4219379 (1980-08-01), Athamas
patent: 4335505 (1982-06-01), Shibata et al.
patent: 4442589 (1984-04-01), Doo et al.
patent: 4455568 (1984-06-01), Shiota
patent: 4466177 (1984-10-01), Chao
patent: 4507159 (1985-03-01), Erb
patent: 4558343 (1985-12-01), Arizumi et al.
patent: 4603059 (1986-07-01), Kiyosumi et al.
Janssen's et al., "The use of 1.1.y Trichloroethane as an Optimized Additive to improve the silicon thermal oxidation technology" J. of Electrochem. Soc. vol. 125, No. 10, 1696-703, Oct. 78.
Gdula, "Composite Dielectric Layer", IBM TDB, vol. 14, No. 9 Feb. 72, p. 2609.
Cheng et al., "Oxidation Characteristics and Electrical Properties of Low Pressure Dual TCE," J. Electroch. Soc. Feb. 1984 pp. 354-359.
Cardon & Franson "Dynamic Semiconductor RAM Structures" Pergamon Press, 1984, pp. 47-50, 153-157, 1984.

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