Integrated ball grid array optical mouse sensor packaging

Details Integrated ball grid array optical mouse sensor packaging Integrated ball grid array optical mouse sensor packaging

2007-04-17

2007-04-17

Luu, Thanh X. (Department: 2878)

Radiant energy

Photocells; circuits and apparatus

Housings

C257S433000, C257S434000, C257S680000, C345S163000, C345S166000

Reexamination Certificate

active

10924474

ABSTRACT:
A compact optical sensor package for use in an optical mouse. The optical sensor package includes a chip enclosure which is physically and electrically bonded to a main circuit Board using Ball Grid Array (BGA) technology. The chip enclosure includes a windowed cover having a window, and a base board hermetically sealed to the windowed cover to enclose the sensor chip. The sensor chip is electrically connected to bonding pads on the inner surface of the base plate. The bonding pads are electrically connected through the base plate to bonding pads on the outer surface of the base plate. The bonding pads on the outer surface of the base plate are elements in this application of Ball Grid Array technology.

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