Integrated arrays of modulators and lasers on electronics

Details Integrated arrays of modulators and lasers on electronics Integrated arrays of modulators and lasers on electronics

2002-06-26

2003-10-14

Whitehead, Jr., Carl (Department: 2813)

Optical: systems and elements

Deflection using a moving element

Using a periodically moving element

C438S029000, C438S026000, C438S024000

Reexamination Certificate

active

06633421

ABSTRACT:

FIELD OF THE INVENTION
This invention relates to optical devices and, more particularly, to optical devices involving lasers and modulators.
BACKGROUND
External modulation has been used in some semiconductor laser systems where one or a few edge emitting lasers were used in a linear arrangement. Single channel use of modulators with edge emitting lasers in a package is also therefore possible. However, presently, two dimensional arrays of edge emitting semiconductor lasers are not in the prior art, hence integration of modulators with such lasers is not possible in the prior art. In addition, modulators that can be integrated with arrays of vertical emitting format lasers, particularly, vertical emitting cavity, distributed feedback (DFB) lasers and distributed Bragg reflector (DBR) lasers, are not available in the prior art.
SUMMARY OF THE INVENTION
As shown in
FIG. 1
, we integrate arrays of vertical cavity modulators
100
on top of arrays of lasers
102
which are integrated on top of electronics
104
(one or more chips). By employing the teachings of the invention, we create large laser arrays in which each of the lasers can be operated at constant light output and the output can be switched on an off, very rapidly, via external modulation through integration of the modulator array on top of the laser array. As a result, we can accomplish a number of advantages including switching lasers in a two-dimensional semiconductor laser array at rates both below, and in excess of, 10 Gb/s.
The advantages and features described herein are a few of the many advantages and features available from representative embodiments and are presented only to assist in understanding the invention. It should be understood that they are not to be considered limitations on the invention as defined by the claims, or limitations on equivalents to the claims. For instance, some of these advantages are mutually contradictory, in that they cannot be simultaneously present in a single embodiment. Similarly, some advantages are applicable to one aspect of the invention, and inapplicable to others. Thus, this summary of features and advantages should not be considered dispositive in determining equivalence. Additional features and advantages of the invention will become apparent in the following description, from the drawings, and from the claims.


REFERENCES:
patent: 4533833 (1985-08-01), Copeland et al.
patent: 5266794 (1993-11-01), Olbright et al.
patent: 5269453 (1993-12-01), Melton et al.
patent: 5385632 (1995-01-01), Goossen
patent: 5477933 (1995-12-01), Nguyen
patent: 5793789 (1995-12-01), Ben-Michael et al.
patent: 5488504 (1996-01-01), Worchesky et al.
patent: 5568574 (1996-10-01), Tanguay, Jr. et al.
patent: 5636052 (1997-06-01), Arney et al.
patent: 5729038 (1998-03-01), Young et al.
patent: 5912997 (1999-06-01), Bischel et al.
patent: 5946130 (1999-08-01), Rice
patent: 5991479 (1999-11-01), Kleinerman
patent: 6005262 (1999-12-01), Cunningham et al.
patent: 6048751 (2000-04-01), D'Asaro et al.
patent: 6118908 (2000-09-01), Bischel et al.
patent: 6136623 (2000-10-01), Hofstetter et al.
patent: 6172417 (2001-01-01), Goossen
patent: 6184066 (2001-02-01), Chino et al.
patent: 6215114 (2001-04-01), Yagi et al.
patent: 6253986 (2001-07-01), Brofman et al.
patent: 6283359 (2001-09-01), Brofman et al.
patent: 6340113 (2002-01-01), Avery et al.
patent: 6343171 (2002-01-01), Yoshimura et al.
patent: 6423561 (2002-07-01), Chino et al.
patent: 6522794 (2003-02-01), Bischel et al.
patent: 2001/0020793 (2001-09-01), Honda
patent: 2001/0038103 (2001-11-01), Nitta et al.
patent: 2002/0081773 (2002-06-01), Inoue et al.
patent: 2002/0126364 (2002-09-01), Miles
patent: 2002/0141011 (2002-10-01), Green et al.
International Search Report dated Oct. 18, 2002.
International Search Report dated Nov. 7, 2002.
International Search Report dated Dec. 17, 2002.
Ahadian, J. F., et al., “Practical OEIC's Based on the Monolithic Integration of GaAs-InGap LED's with Commercial GaAs VLSI Electronics”, IEEE Journal of Quantum Electronics, vol. 34, No. 7, pp. 1117-1123, Jul. 1998.
Alduino, A.C. et al., “Quasi-Planar Monolithic Integration of High-Speed VCSEL and Resonant Enhanced Photodetector Arrays”, IEEE Photonics Technology Letters, vol. 11, No. 5, pp. 512-514, May 1999.
Anderson, B., “Rapid Processing And Properties Evaluation Of Flip-Chip Underfills” Dexter Electronic Materials, 9 pages.
Corbett, B. et al., “Resonant Cavity Light Emitting Diode and Detector Using Epitaxial Liftoff”, IEEE, vol. 5, No. 9, pp. 1041-1043, Sep. 1993.
Geib, K.M. et al., “Monolithically Integrated VCSELs and Photodetectors for Microsystem Applications”, IEEE, pp. 27-28, 1998.
Goodman, J. et al., “Optical Interconnections for VLSI Systems”, Proceedings of the IEEE, vol. 72, No. 7, pp. 850-865, Jul. 1984.
Goossen, K. W. et al., “GaAs 850 nm Modulators Solder-Bonded to Silicon”, IEEE Photonics Technology Letters, vol. 5, No. 7, Jul. 1993.
Goossen, K. W. et al., “GaAs MQW Modulators Integrated with Silicon CMOS”, IEEE Photonics Technology Letters, vol. 7, No. 4, pp. 360-362, Apr. 1995.
Hibbs-Brenner, M.K., et al., “VCSEL/MSM Detector Smart Pixel Arrays”, IEEE, pages 3 and 4, 1998.
Lesser, M.P. et al., “Bump Bonded Back Illuminated CCDs”, SPIE, vol. 1656, pp. 508-516, 1992.
McLaren T. et al., “Assembly of VCSEL Based Smart Pixel Arrays”, IEEE/LEOS Summer Topical Meeting: Smart Pixels, pages 49 and 50, Aug. 1996.
Nakahara, T., et al., “Hybrid Integration of Smart Pixels by Using Polyimide Bonding: Demonstration of a GaAs p-i-n Photodiode/CMOS Receiver”, IEEE Journal Of Selected Topics In Quantum Electronics, pp. 209-216, 1999.
Ohsaki, T., “Electronic Packaging in the 1990's -A Perspective From Asia”, IEEE Transactions On Components, Hybrids, And Manufacturing Technology, vol. 14, No. 2, pp. 254-261, Jun. 1991.
Pommerrenig, D.H. et al., “Hybrid silicon focal plane development: an update”, SPIE, vol. 267, pp. 23-30, 1981.
Pu, R. et al., “Comparison of Techniques for Bonding VCSELs Directly to ICs”, SPIE vol. 3490, pp. 498-501, Jun. 2005.
Pu, R. et al., “Hybrid Integration of VCSELs to Foundry Fabricated Smart Pixels”, IEEE/LEOS Spring Meetings, pages 25 and 26, 1997.
Sasaki, J. et al., “Self-aligned Assembly Technology for Optical Devices Using AuSn Solder Bumps Flip-Chip Bonding”, pp. 260-261.

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