Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
2000-01-13
2001-07-24
Lateef, Marvin M. (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S104330, C361S699000, C257S714000, C174S015100, C174S016300
Reexamination Certificate
active
06263957
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention is directed, in general, to a cooling device for electronic components and, more specifically, to an integrated active cooling device employable with board mounted electronic components.
BACKGROUND OF THE INVENTION
Designers of electronic circuits must incorporate into their designs methods to control heat generated by electronic components in the circuit. Unless controlled, the heat build-up will cause component and circuit failure. Temperature control, therefore, is vital to circuit reliability. The preferred method to controlling temperature is to dissipate the excess heat into the ambient air surrounding the electronic circuit before temperatures rise to a level where damage can occur.
The traditional method to contain temperature build-up is to associate heat generating components with heat dissipation devices, such as heat sinks. The heat dissipation device absorbs heat from the component and provides for a more efficient transfer of excess heat into the surrounding ambient air. In most cases, the heat generating component will be mounted directly to the heat dissipation device to more efficiently remove the excess heat.
Although traditional heat sinking methods can be used successfully in most cases, the problems associated with temperature control have become more pronounced as electronic circuits have become more complex. Such circuit complexity often results in a circuit that requires a larger number of components, which frequently are more powerful and can generate even more heat. The problem is further complicated by the fact that lower profile and more compact electronic systems have become the preferred choice of customers. This means that space must be found in such low profile, compact systems for both the electronic components that make up the circuit as well as the heat dissipation devices that such components require in order to prevent heat related damage. In short, as the power density of circuits has increased, the use of classic finned heat sinks may no longer adequately address the corresponding heat dissipation requirements.
Some of the foregoing problems have been resolved by using active, rather than passive, systems to control temperature build up. For example, certain board mounted electronic components that generate large amounts of heat can have an active cooling device, such as a small fan, dedicated solely to the device. In those situations where a fan is used as the active device, the fan is mounted directly on the component and improves cooling by moving more ambient air over the component. Using a fan in this manner will provide more efficient cooling in less space than a classic finned heat sink.
Notwithstanding the benefits associated with using an active cooling device, such as a fan, with a heat generating electronic component, the increasing demands for more aggressive temperature control require new and improved heat control methods.
Accordingly, what is needed in the art is an active heat control device that can be used to efficiently control temperature build-up caused by heat generating electronic components in an electronic circuit.
SUMMARY OF THE INVENTION
To address the above-discussed deficiencies of the prior art, the present invention provides an integrated cooling device for use in cooling an electronic component or an integrated circuit and a method of manufacturing the same. In one embodiment, the device includes: (1) a plate couplable to and supportable by the electronic component, the plate having at least one channel therein; (2) a closed-circuit circulation pipe having a heat-receiving portion disposed in the at least one channel to place the heat-receiving portion in thermal communication with the plate, the circulation pipe further having a heat-removing portion distal from the heat-receiving portion; (3) a coolant located within the circulation pipe; and (4) a pump coupled to the circulation pipe, supported by the plate and operable to cause the coolant to circulate through the circulation pipe.
In an alternative embodiment, wherein the device is used in cooling an integrated circuit, the device includes: (1) a plate having a footprint based on a footprint of the integrated circuit, the plate couplable to and supportable by the integrated circuit and having at least one channel therein; (2) a closed-circuit circulation pipe having a heat-receiving portion disposed in the at least one channel to place the heat-receiving portion in thermal communication with the plate, the circulation pipe further having a heat-removing portion distal from the heat-receiving portion and substantially within a footprint of the plate; (3) a coolant located within the circulation pipe; and (4) a pump coupled to the circulation pipe, supported by the plate and operable to cause the coolant to circulate through the circulation pipe.
The present invention, in broad scope, therefore introduces the broad concept of an active cooling device that can be used to cool a heat generating electronic component. The invention provides for a closed-circuit circulation system where, as the coolant is circulated through a circuit, heat is gathered from the electronics device while the coolant is in close proximity to the device and then, when the coolant is no longer in close proximity to the device, the heat is transferred to the surrounding ambient air.
In one embodiment of the present invention, the channel through the plate that is couplable to and supportable by the electronic component is circuitous. In one aspect of the invention the portion of the circulation pipe that is distal from the heat-receiving portion and constitutes the heat-removing portion is circuitous. In yet another embodiment of the present invention, the circulation pipe comprises copper. In still another embodiment, the coolant comprises a liquid, such as water.
In a particularly useful embodiment of the invention, the channel is located in a surface of the plate that is adjoinable to the electronic component. The system, in one embodiment of the invention, may also include a line cord that is coupled to the pump and couplable to the electronic component so that the pump may draw electric power from the electronic component to activate the pump.
The foregoing has outlined, rather broadly, preferred and alternative features of the present invention so that those skilled in the art may better understand the detailed description of the invention that follows. Additional features of the invention will be described hereinafter that form the subject of the claims of the invention. Those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiment as a basis for designing or modifying other structures for carrying out the same purposes of the present invention. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the invention in its broadest form.
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Chen Shiaw-Jong S.
Hooey Roger J.
Radke Robert E.
Lateef Marvin M.
Lucent Technologies - Inc.
McKinnon Terrell
LandOfFree
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